A hybrid photonic integration scheme based on flip-chip bonding combined with vertical coupling is presented in this work. offering a novel solution for the integration of active and passive chips. An offset quantum-well laser is flipped and bonded into the pre-set cavity of the passive chip. The light emitted from the laser propagates through a taper into the passive chip. https://www.chiggate.com/eeboo-memory-matching-game-animal-pre-school-supply/