Chiplet-based design is the future of high-performance semiconductors. Engineers in this domain work on die partitioning, interposer design, advanced interconnects, TSV bonding, and 2.5D/3D packaging. Companies such as AMD, TSMC, Intel, and Tata Electronics are expanding chiplet R&D roles in India. Required expertise includes floorplanning, thermal modeling, SerDes connectivity, and p... https://bestnanotech.in/candidate/